The APECS pilot line: European chiplet innovation
APECS leads the way in advanced packaging and heterogeneous integration by providing diverse technologies on a single platform.
APECS leads the way in advanced packaging and heterogeneous integration by providing diverse technologies on a single platform.
APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative.
Thanks to substantial funding from the German Federal Ministry of Education and Research (BMBF) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt, it will be possible to further expand the R&D infrastructure in the coming years within the framework of the APECS pilot line.