Vision and Purpose of the APECS Pilot Line

Innovating where European industry and science need it most.

To be the leading European platform for advanced packaging and heterogeneous integration innovation, APECS envisions a future where the European semiconductor industry is not only internationally competitive, but also a driving force behind the next generation of integrated systems.​

By bringing together diverse technologies, fostering multi-level collaboration, and providing seamless access to cutting-edge solutions, APECS aims to build a resilient and thriving community of interest that enables European companies, from Startups through SMEs to industry leaders, to play a key role in the global semiconductor market.

Connecting and collaborating.

The APECS Pilot Line is dedicated to catalyze innovation and cooperation across Europe’s semiconductor landscape. Our purpose is to bridge the gap between research, industry, and policy to drive the continent’s competitiveness in advanced packaging and heterogeneous integration. ​Our distinctive value proposition: Provision of the world's first comprehensive integration platform for 2.5D and 3D heterogeneous packaging of a wide range of promising core technologies such as CMOS, III-V, for RF, photonics and sensors. The platform includes end-to-end design and pilot production capacity to validate and integrate the technologies beyond the current state-of-the-art advanced packaging, characterization, testing and reliability to ensure manufactuability of the validated solutions. It supports an unprecedented range of component technologies and materials complemented with world-class system design, interconnection and assembly techniques as well as characterization, testing, reliability and safety evaluation. ​All the developments are taking place under the dictum of the European Green Deal.