APECS

APECS – European pilot line for advanced packaging and heterogeneous integration

APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) is a European pilot line established under the EU Chips Act. It provides industry, SMEs and research organizations with access to technologies, infrastructure and expertise for chiplet innovation, system integration and industrial deployment. By connecting development, testing and pilot-scale manufacturing, APECS accelerates the transition from research to application and strengthens Europe’s semiconductor ecosystem.

Open-access technologies to the entire chip industry

Annual open access call

We invite players across the semiconductor value chain to submit project ideas for selected pilot line technologies. This year's call starts on April 1, 2026.

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Whether developing chiplets, sensors, or complex systems, APECS helps bringing innovations to market efficiently and reliably.

Innovating right where European industry and science need it most

What APECS offers

Access technologies, infrastructure and services for advanced packaging, chiplets and system integration.

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How APECS works

A distributed European pilot line connecting design, manufacturing and testing into one continuous workflow.

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Who APECS is for

For industry, SMEs and research developing and scaling semiconductor technologies.

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How to access APECS

Access APECS via open calls or collaboration to develop and scale technologies without own infrastructure.

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Knowledge hub

FAQ

Everything you need to know about the APECS pilot line.

APECS FAQ

Latest publications

Learn more about our latest research outcomes and scientific contributions.

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Get in touch and learn more about APECS

APECS at SEMICON Europe

APECS affirms its commitment to Europe: Technological excellence and close cooperation among pilot lines at SEMICON Europe.

Press release

G3C gets underway

"German Chips Competence Centre" launched as gateway to European pilot lines and design infrastructure.

Press release

See all APECS events and webinars

Lets meet! Here is a list with all upcoming events and webinars.

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LinkedIn & Newsletter

Don't miss the latest news about APECS and chiplet innovations!

LinkedIn-Newsletter

The APECS pilot line in a nutshell

Matching the core needs of the European industry

Facilitating multilevel cooperation between European RTOs, industry, academia, and policy makers

Reshaping our national know-how within the European arena

Driving European competitiveness at peak performance

Bonding around heterogeneous integration and advanced packing under the demands of the green deal

Catalyzing fresh prospects for regional chip manufacturing

Funding

APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative.

Thanks to substantial funding from the German Federal Ministry of Research, Technology and Space (BMFTR) and the federal states of Saxony, Berlin, Bavaria, Schleswig-Holstein, Baden-Württemberg, North Rhine-Westphalia, Brandenburg, and Saxony-Anhalt, it will be possible to further expand the R&D infrastructure in the coming years within the framework of the APECS pilot line.

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