Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

Access

Low volume production – high value chips. The APECS pilot line gives you access to key technologies and institutions.

© Fraunhofer ISIT

For chip foundries

  • Predevelopment of technology modules
  • Access to design services to create foundry business
  • Outsourcing handling of prototype runs / small volume business

© Fraunhofer ISIT

For IDMs

  • R&D services, focus on transferability into commercial production lines
  • Use of Advanced heterogenous system integration for creating new products and business offerings
  • Options for insourcing of high innovative products with volume forecast
  • Design services for IDMs' new chips

For semiconductor customers

 

  • Easy access to specialized technologies for high complexity products
  • Use of advanced heterogeneous system integration for creating new products and business offerings
  • Proof of concept, demonstrators with high TRL / low volume production
  • Scaling up into commercial technologies in line with market growth

© Maksim Shmeljov | Adobe Stock

For the research community

 

  • Access to extended technology capabilities in research cooperation
  • Support of transfer of research results into applications

© Blue Planet Studio | Adobe Stock

For start-ups

 

  • Access to special technology
  • Prospect to create technology start-up without own cleanroom

Added value for cooperation with APECS:

  • Cooperation with FMD as the major RTO on the critical area of heterogeneous integration in EU
  • Increased outreach to EU and national research ecosystem
  • Opportunity to network with major industries in joint projects