Advanced Packaging and Heterogeneous Integration for Electronic Components and SystemsAt APECS, we offer open-access technologies to the entire chip industry including chip foundries, IDMs, customers, academia, and start-ups. Our pilot line covers the full value chain, from design to advanced packaging, testing, and characterization, enabling faster innovation and easy tech transfer. With state-of-the-art equipment, expertise, and scalable processes, we support Europe’s semiconductor ecosystem and next-gen electronics. Whether developing chiplets, sensors, or complex systems, APECS helps bringing innovations to market efficiently and reliably.
Access
Low volume production – high value chips. The APECS pilot line gives you access to key technologies and institutions.
Our capabilities include:
- Surface technologies
- Advanced packaging and assembly technologies
- Chiplet and chip development
- Sensors
- Design offers
- Characterization, test and reliability
- Measurement technologies
- Failure analysis
- Hardware security
Coming soon: Open calls
Dedicated open call on specific services and technologies
APECS open calls invite all players in the semiconductor industry—including chip foundries, IDMs, customers, SMEs, start-ups, and academia—to submit project requests for collaboration on our pilot line technologies.
Taking place once a year from 2026 to 2029, these calls promote specific advanced technologies and offer selected participants hands-on access to our equipment, expertise, and full value chain.
Projects from SMEs, start-ups, and academic partners will be given preferential consideration, helping accelerate innovation and strengthen Europe’s semiconductor ecosystem.
What is an Open Call?
APECS open calls (yearly 2026–2029) invite the semiconductor industry to propose projects ideas or customer’s needs on specific pilot line technologies, offering access to equipment, expertise, and the full value chain. SMEs, start-ups, and academia receive priority access to foster innovation and strengthen Europe’s semiconductor ecosystem.
What can companies, RTOs and academia expect from the APECS pilot line and the involved institutes?
At APECS, we provide open-access technological capabilities to the entire chip industry—including chip foundries, IDMs, semiconductor customers, academia, and start-ups. Our pilot line supports the full value chain, from design and development to advanced packaging, testing, and characterization, enabling faster innovation and seamless technology transfer.
How can the industry access the technologies and products of the pilot line?
Potential customers can submit their inquiries via our contact form or directly to one of the technology experts from the FMD office and the institutes. An expert team will evaluate the inquiry and choose the right technological group/partner. After an initial call, project proposals can directly discussed with the designated partner.
Can companies from every country access the pilot line?
The offers of the APECS pilot line are designated to all EU member states and countries that are part of the Horizon Europe program. Besides that, companies from other countries can apply based on certain criteria.
What is the opportunity for the industry with the APECS pilot line?
The APECS pilot line provides easy and open access to cutting edge technologies in the field of advanced packaging and heterogeneous integration. It delivers an easy possibility to reach technological goals for the whole semiconductor industry.
Added value for cooperation with APECS:
- Cooperation with FMD as the major RTO on the critical area of heterogeneous integration in EU
- Increased outreach to EU and national research ecosystem
- Opportunity to network with major industries in joint projects
Publications
Find out more about FMD publications on the subject of chiplet technologies on the FMD website.