Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems
Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems

Access for semiconductor customers

© Fraunhofer ISIT
© Fraunhofer ISIT
  • Easy access to advanced technologies through linked pilot line facilities, design, and system integration to drive digital innovation.
  • Heterogeneous system integration enabling new products and business opportunities from research to industry.
  • High-TRL demonstrators & low-volume production bridging innovation and practical application.
  • Scaling to commercial technologies aligned with market growth and performance needs.
  • Access to in-house chip design tools, platforms, and APECS capabilities.
  • Strengthening the European semiconductor supply chain by connecting RTOs, manufacturers, suppliers, and SMEs.

APECS delivers the full semiconductor value chain—from testing and analysis to training—offering flexible entry/exit options and fast, high-quality project execution.

With Europe increasingly dependent on outsourced assembly and testing, advanced packaging and chiplet integration are driving the next generation of smaller, more efficient, and versatile electronic systems, reshaping device manufacturing and functionality.

Connect with us

First open access call starts April 1st

Submit your project idea and get access to APECS technologies

APECS open calls invite all players in the semiconductor industry—including chip foundries, IDMs, customers, SMEs, start-ups, and academia—to submit project requests for collaboration on our pilot line technologies.

Taking place once a year from 2026 to 2029, these calls promote specific advanced technologies and offer selected participants hands-on access to our equipment, expertise, and full value chain.

Projects from SMEs, start-ups, and academic partners will be given preferential consideration, helping accelerate innovation and strengthen Europe’s semiconductor ecosystem.

 

To open access call