News and Events

The pilot line for “Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems” (APECS) marks a major leap forward in strengthening Europe’s semiconductor manufacturing capabilities and chiplet innovation as part of the EU Chips Act. By providing large industry players, SMEs, and start-ups with a facilitated access to cutting-edge technology, the APECS pilot line will establish a strong foundation for resilient and robust European semiconductor supply chains. Within APECS, the institutes collaborating in the Research Fab Microelectronics Germany (FMD) will work closely with European partners, to make a significant contribution to the European Union´s goals of increasing technological resilience, strengthening cross-border collaboration and enhancing its global competitiveness in semiconductor technologies. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the “Chips for Europe” initiative. The overall funding for APECS amounts to € 730 million over 4.5 years.

Themed "Innovation and Collaboration: Powering Sustainable Exponential Growth", SEMICON Europa supports the European semiconductor ecosystem, highlighting the important role in driving sustainable exponential growth through innovation and strategic collaborations. APECS Pilot Line is represented at Chips JU booth C2419.

The European Forum for Electronic Components and Systems. The Chips Joint Undertaking is a collaborative effort to bolster Europe's position as a global leader in the semiconductor industry.

SENSOR+TEST is the world's leading forum for sensor, measurement and testing technology. When SENSOR+TEST – the leading international trade fair for sensor, measuring and testing technology – opens its doors again in Nuremberg on Tuesday, 6 May 2025 under the motto "Welcome to the Innovation Dialog!", visitors can expect three days of pure technology with innovations to touch. Until 8 May 2025, exhibitors will inform visitors and experts from all over the world on site about the trends in the industry. The exhibition will become even more attractive because an exciting supporting programme will be compiled. The SMSI 2025 - Sensor and Measurement Science International Conference will take place parallel to the exhibition and will enrich the event with scientific facts and outlooks for the future of this industry.

Heterogeneous Systems for the Intelligently Connected Era.

The 25th European Microelectronics & Packaging Conference. The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS. The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.

The 28th edition of the European Microwave Week (EuMW 2025) will come to Utrecht to continue the annual series of highly successful microwave events that started back in 1998.

SEMICON Europa 2025 is co-located with productronica in Munich, Germany creating the strongest single event for electronics manufacturing in Europe, and broadening the range of attendees across the electronics chain.