Advanced Packaging and Heterogeneous Integration for Electronic Components and SystemsEE Times Europe: Exclusive Interview with FMD's Stephan Guttowski on APECS Pilot Line
In this exclusive interview, EE Times Europe spoke with Stephan Guttowski, managing director of Research Fab Microelectronics Germany (FMD), about the announcement this morning of a new pilot line, called APECS, an acronym for Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems.
APECS is designed to improve microelectronic system production in Europe and is supported by the EU Chips Act. It is a collaborative effort involving experts from institutions such as CEA-Leti and imec. In this video, Guttowski explained how the initiative will leverage existing capabilities at FMD and enhance access to state-of-the-art technologies for companies across Europe.