Advanced Packaging and Heterogeneous Integration for Electronic Components and SystemsEvent
Event details
Program
The 25th European Microelectronics & Packaging Conference.
The European Microelectronics and Packaging Conference (EMPC 2025) is the premier international conference for microelectronics packaging, owned and sponsored by IMAPS-Europe and co-sponsored by IEEE-EPS.
The conference program will focus on industrial needs and trends and on academic long-term solutions. The event brings together researchers, innovators, technologists, business and marketing managers with an interest in semiconductor packaging.
Registration
Location
World Trade Center, Grenoble
France
Date
September 16, 2025 - September 18, 2025