Advanced Packaging and Heterogeneous Integration for Electronic Components and SystemsEvents / December 05, 2024 - December 06, 2024
EFECS 2024 - Strengthening EU Competitiveness
The European Forum for Electronic Components and Systems
EFECS 2024 - Strengthening EU Competitiveness
Event details
Program
The Chips Joint Undertaking is a collaborative effort to bolster Europe's position as a global leader in the semiconductor industry. With the increasing demand for advanced chip technologies and their strategic importance across various sectors, this initiative is more vital than ever.
What to Expect at EFECS 2024:
- Insightful presentations: Gain a comprehensive outlook on the Chips JU programme's mission, addressing societal and industrial challenges through advanced chip technologies.
- Valuable networking: Create meaningful connections with stakeholders and the entire ECS community, fostering collaboration and innovation.
Strategic discussions: Participate in discussions on reinforcing the EU’s strategic autonomy in electronic components, supporting innovation, and enhancing technological capacity.
Registration
Location
Ghent, Belgium
Date
December 05, 2024 - December 06, 2024
